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The reliability of BN300 Substrate, a heat resistant, high flexural
modulus substrate, has been proven by its performance in semiconductor
packaging applications. The high Tg substrate is formulated to perform
in harsh environments and critical reliability applications typically
encountered in the automotive industry including under the hood,
the wheel and passenger compartments.
Requirements for harsh environment electronics in automotive applications
are becoming more stringent and Mitsui Chemicals' high-density organic
substrate will be one of the leading choices for high pin count
package solutions to address these requirements.
The combination of a low Z-Axis coefficient thermal expansion (CTE)
and excellent mechanical properties yield significant performance
advantages including:
 • High-heat resistance
(Tg = 300ºC)
• Excellent
thermal shock resistance
• High
reliability
• Low
dielectric constant and dissipation factor
• Excellent
warpage resistance
• Low
Z-axis coefficient of thermal expansion (CTE)
Exceptional structural properties are achieved because the BN300
glass fiber reinforced resin is used both on core and the Prepreg
(Pre-impregnated). The substrate is suitable in a variety of automotive
applications including interior, exterior and under the hood electronics.
Interior Automotive Applications
The high Tg substrate can be used in a variety of cabin electronics
and passenger compartment components including:
• AV Equipment
• Monitor
• Navigation System
(GPS)
• High Speed Communication
(Bluetooth, Wireless LAN)
• Seat sensor
• Interior light
• Air conditioner
Exterior Automotive Applications
On the exterior, the heat resistant substrate is used in critical
reliability applications.
• Air Pressure
Sensor (Tire)
• Anti-collision Radar
• ABS
• Airbag
• Anti-theft equipment
• Key-less Entry
Under the Hood/Powertrain
Under the hood applications revolve around engine management systems
• Transmission
• Starter
• Environmental control
unit (ECU)
• Flight Information
Service (FIS)
Reliability
The following table illustrates the reliability of this heat resistant,
high flexural modulus substrate.
BN300
Table of Reliability Data
Properties
The following two charts graphically depict the excellent mechanical
properties of the high Tg substrate.
BN300
Elasticity Measurement
CTE
of Z-Axis
For more information on BN300 Substrate
for IC (Integrated Circuit), please contact the product manager.
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