BN300- Table of Reliability Data
Items	Condition	Sample Form	Result
			Judgement	Good/Number
JEDEC L3	30C/60%RH/192h	4layer 0.6mm thickness substrate	PASS	10/10
	-> IR 240C/10sx5
JEDEC L2	85C/60%RH/168h	4layer 0.6mm thickness substrate	PASS	10/10
	-> IR 240C/10sx5
JEDEC L1	85C/85%RH/168h	2layer, 70mm x 120mm board substrate	PASS	5/5
	-> IR 260Cx3cyc.
TB	150C/3.6V/1000h	TH 0.20mm in diameter,	PASS	5/5
		PITCH 0.40mm, 20TH
THB	85C/85%RH/3.6V/1000h	TH 0.20mm, PITCH 0.40mm, 20TH	PASS	5/5
		L/S=50/50 Comb pattern
HAST	130C/85%RH/2.3atm	TH 0.20mm, PITCH 0.40mm, 20TH	PASS	5/5
	/>3.6V/200h	L/S=50/50 Comb pattern
TCT	150C(10min)/-55(10min)	TH 0.20mm in diameter,	PASS	5/5
	/1000cycle	PITCH 0.40mm, 20TH
PCT	121C/100%RH/100h	TH 0.20mm in diameter,	PASS	5/5
	+RT/3.6V/20h) x 2 cycle	PITCH 0.40mm, 20TH
PCT	121C/100%RH/6h	2layer 1.6mm thickness board	PASS	10/10
	-> Solder Float(260-320C)